Department of
MECHANICAL ENGINEERING

Faculty & Staff

Dr. Peter Rodgers Associate Professor Office: Ruwais 3012 Phone: +971 2 607 5397 Fax: +971 2 607 5200 Email: prodgers@pi.ac.ae

• Ph.D. University of Limerick, 2000

Peter Rodgers is an expert in the thermal management and reliability of electronic equipment. He was formally with the CALCE Electronic Products and Systems Center, University of Maryland; Nokia Research Center, Finland; and Electronics Thermal Management, Ltd., Ireland. In these positions he has consulted on a wide range of aspects in electronics cooling, spanning integrated circuit packaging to facility cooling. His research interests have covered conventional and high-performance cooling technologies, the development of advanced experimental techniques to characterize thermofluid phenomena, and computational fluid dynamics (CFD). He has authored or co-authored over 50 journal and conference publications on a broad range of topics in thermofluids. He has been an invited lecturer, keynote speaker, panelist, and session chair at international electronics thermal management conferences. Dr. Rodgers received the 1999 Harvey Rosten Memorial Award for his publications on the application of CFD analysis to electronics thermal design. He is a member of several international conference program committees, and is program co-chair for EuroSimE 2006.

HONORS and AWARDS

• Recipient of the 1999 Harvey Rosten Memorial Award for Excellence for the advancement of thermal analysis of electronic equipment.

PROFESSIONAL SERVICE

• Conference program committee member for EuroSimE, SEMI-THERM and THERMINIC international conferences.
• Program co-chair for EuroSimE 2006.
• Session co-chair for “Characterization of Air-Cooled Packages and Modules,” ITHERM 2006
• Session chair for “Thermal Interface Materials,” SEMI-THERM 2006
• Contributor to “Design Technologies - Thermal Management” International Electronics Manufacturing Initiative (iNEMI) technology roadmap.
• Journal reviewer for Transactions of the ASME, Journal of Heat Transfer; Transactions of the ASME, Journal of Electronic Packaging; IEEE Transactions on Components and Packaging Technology

EXPERTISE

• Heat and mass transfer
• Fluid flow and heat transfer measurements
• Refrigeration/air conditioning and cryogenics
• Electronics thermal management
• Electronics prognostic health monitoring

REPRESENTATIVE PUBLICATIONS

• Rodgers, P., Eveloy, V., and Davies, M., 2003, “An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection: Parts I and II,” Transactions of the ASME, Journal of Electronic Packaging, Vol. 125, No. 1, pp. 67-83.
• Vichare, N., Rodgers, P., Eveloy, V., and Pecht, M.G., 2004, “In-Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics,” IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 4, pp. 658-663.
• Rodgers, P., Eveloy, V., and Pecht, M., 2005, “Extending the Limits of Air-Cooling in Microelectronic Equipment,” Proceedings of the Sixth conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), April 18-20, Berlin, Germany, pp. 695-702.
• Rodgers, P., Eveloy, V., and Hashmi, M.S.J., 2005, “An Investigation into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature,” Transactions of the ASME, Journal of Electronic Packaging, Vol. 127, No. 1, pp. 67-75.
• Eveloy, V., Rodgers, P., 2005, “Prediction of Electronic Component-Board Transient Conjugate Heat Transfer,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4